Plasma Spraying Setter Plates
The zirconia is melted and sprayed on the surface of the alumina substrate through plasma spray process. The plasma spraying setter plate combines the high-temperature chemical stability and thermal shock resistance of zirconia and the high-temperature anti-bending and anti-cracking properties of alumina. These excellent properties can ensure the electrical performance, reliability, appearance and long service life of electronic component chips.
Application:
It is used in electronic industry for sintering MLCC, ceramic low temperature sintered substrate (LTCC), varistor, inductor, wafer capacitor and other industries, and debinding and sintering of sensitive powder metallurgy products and magnetic material products.
Alumina substrate |
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Physical characteristic |
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Items |
Data |
Items |
Data |
|
Al2O3 |
≥75.0Wt.% |
Bulk Density |
≥2.5 g/cm3 |
|
SiO2 |
≤25.0Wt.% |
Apparent porosity |
≥17% |
|
Fe2O3 |
≤0.5Wt.% |
Thermal expansion 1000℃ |
≤1.0% |
|
|
|
Max.use temperature |
≤1500℃ |
|
Zirconia spray-fused coating |
ZrO2 |
≥88.0Wt.% |
|
|
Y2O3 |
≥5.0Wt.% |
|
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Plasma Spraying Setter Plate Commercial Size
Product |
Product specification(mm) |
Six-feet spraying board |
310×150×14 150×150×12.4 |
H spraying board |
150×150×17 |
Spraying flat |
150×150×4 |
Spraying sagger |
125×125×15 |
Spraying segment |
R270×R110×4.5 |
Spraying chequered plate |
130×130×2 |